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Aim 688 One-Step Underfill
Aim 688 One-Step Underfill


 

Product Code: AIM-688
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Description
 
  • A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. Available in industry standard sizes.
Features
  • Excellent Capillary Function for Fast Reflow Compatible with No-Clean Flux Residues Odorless During Printing and Curing Flux Action to Make Solder Connections Non-Hygroscopic Reworkable Good Storage Properties No Voiding Cures in Lead-Free Profile .
  • TDS
  • MSDS

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